Glossary

Ball Grid Array
a leadless surface mount device (SMD). Unlike traditional SMDs, this type of device does not have pin leads, instead it contains solder balls at the bottom of the device which melt and make contact to the pattern on boards during assembly
Barrel Finishing
production finishing process that produces a low-pressure abrasion action by tumbling work pieces in a hexagonal or octagonal barrel together with an abrasive slurry
BGA
Ball Grid Array. A leadless surface mount device (SMD). Unlike traditional SMDs, this type of device does not have pin leads, instead it contains solder balls at the bottom of the device which melt and make contact to the pattern on boards during assembly.
Bill of Materials
a comprehensive listing of all components and subassemblies that go into a specific product, showing the quantity of each required to assemble the item
BOM
Bill of Materials. A comprehensive listing of all components and subassemblies that go into a specific product, showing the quantity of each required to assemble the item
Box-build
a term commonly used to describe assembly work other than printed circuit board (PCB) production. The electromechanical assembly process involves enclosure fabrication, installation of subassemblies and components, and routing of cabling or wire harnesses
Burring
a thin ridge or area of roughness produced in cutting or shaping metal
CAD
Computer-Assisted Design
CAM
Computer-Assisted Manufacturing
Class 100,000
federally regulated standard of environmental cleanliness: airborne particulate level kept below 100,000 per cubic foot
Clean room
facility in which environmental elements (heat, humidity, microbial growth, etc.) and user cleanliness are controlled
CM
Contract manufacturer. A company that engages in product assembly, engineering services, order fulfillment and product distribution. A CM usually works on behalf of an OEM.
CNC
Computer Numerical Control. A dedicated purpose computer that has the capability to read computer codes
COB
chip on board - a technology that utilizes wire bonding to connect large-scale integrated circuits directly to printed circuit boards
COF
chip on film - an assembly method for bonding integrated circuit chips and other components onto a flexible printed circuit
COG
chip on glass - a process that connects integrated circuits directly to LCD panels without the need for wire bonding
conformal coating
A spray-on clear non-conductive coating covers components and circuit board to protect them against oxidation and from hazard environment
Contract manufacturer
a company that engages in product assembly, engineering services, order fulfillment and product distribution. A CM usually works on behalf of an OEM.
Convergence
from the laser's perspective, convergence refers to the laser growing smaller as it moves from point "a" to point "b." After the laser passes through the focus lens, the beam converges until it reaches its waist point.
copper plating
copper thickness usually specified in terms of number of ounces or square footage. The thickness of copper specified will be the final thickness of base material plus copper plating thickness
copper thickness
copper thickness usually specified in terms of number of ounces or square footage. The thickness of copper specified will be the final thickness of base material plus copper plating thickness
Core competencies
activities or practices, such as product development, deemed by a company as critical to its long-term success and growth. Typically, core competencies are based on skills or knowledge sets rather than products or functions
cut-and-clinch
clinch is an operation bending leads in angle to avoid component pop-up during wave-soldering after parts are automatically inserted to a board. Cut-and-clinch is a standard operation of axial, radial and IC inserters
Diamond Laser
coherent diamond 64 CO2 Laser - A 150 watt sealed beam laser.
Divergence
From the laser's perspective, divergence refers to the laser growing larger as it moves from point "a" to point "b." After the laser passes through the waist point, the beam begins to diverge.
DNC
Direct Numerical Control. The direct control of a number of separate CNC machine tools by a large central host computer; part programs are downloaded directly into the memory of a CNC machine tool.
Drilling
making a round hole or cavity by boring directly into a solid surface with rotating bits
ECM
electronic contract manufacturing
ECO
Engineering change order. An alteration made to an AVL or BOM, such as the replacement of one component by a substitute component. Any changes should be prepared, approved and incorporated promptly and correctly to minimize problems.
EDM
Electrical Discharge Machining. High-energy electric current melts base metal for burr-free machining. Wire EDM can produce intricate patterns, complex shapes with extreme precision. Microhole EDM used for high-speed drilling of micro-fine holes. Minimal variation throughout production.
electro-less gold plating
A gold plating process as a substitution of regular Tin/Lead plating. This plating applies a layer of thin gold (a fraction of micro inches) to the entire circuit, it is a cost effective solution for circuits required on board switch patterns, and a good alternative to selective gold plating
Electronics manufacturing services
an industry based on providing contract design, manufacturing and product support services on behalf of OEMs.Traditional services include PCB assembly, box-build and testing. Today, EMS providers are also providing numerous services such as supply chain management, global distribution, logistics, customer support and repair. However, all intellectual property belongs to the OEM.
Electropolishing
producing a smooth, bright surface on a metal by immersion in an electrolytic bath
EMS
Electronics manufacturing services. An industry based on providing contract design, manufacturing and product support services on behalf of OEMs.Traditional services include PCB assembly, box-build and testing. Today, EMS providers are also providing numerous services such as supply chain management, global distribution, logistics, customer support and repair. However, all intellectual property belongs to the OEM.
EMS
electronic manufacturing services
Engineering change order
an alteration made to an AVL or BOM, such as the replacement of one component by a substitute component. Any changes should be prepared, approved and incorporated promptly and correctly to minimize problems.
fabrication drawing
A drawing required for manufacturing. For circuit board fabrication, some times refer to as drill drawing.
FCB
flip chip bonding
Fiber optics
thin transparent fibers of glass or plastic that are enclosed by material of a lower index of refraction and that transmit light throughout their length by internal reflections
First-pass yield
the percentage of product tested that passed inspection on first attempt
flux
A preserve agent for soldering. Old types of flux require cleaning process after soldering. There is No-cleaning-flux available now and it is safe for both circuitry and environment.
Four and five axis machining
the use of multi-directional tool movement in a machine in which tools are held on axes which provide rotating vertical and horizontal motions on different planes
FPC
flexible printed circuit - a patterned arrangement of printed wiring utilizing flexible base material with or without flexible cover layers
FPHS
fine pitch heat seal
FPY
First-pass yield. The percentage of product tested that passed inspection on first attempt.
FR-4
General purpose epoxy/fiberglass woven fabric PCB material. FR-4 is similar to G-10, but fire retardant. FR-4 is much more widely used than is G-10, and is used where the material requirement calls for G-10. FR-4 is sometimes referred to as G10FR.
functional test
A test to verify product's behaviors after components are mounted on board. The test is performed according to customer's specification and parameters provided. Programming and setup are involved. Generally, functional test are performed as an alternative to in-circuit test in most application
G-10
General purpose epoxy/fiberglass woven fabric PCB material. Most vendors do not stock this material, instead, they use high grade material like FR-4 as a substitution if you specify G-10.
Gerber file
A widely accepted file format for photo plotting and as input to generate many format of testing program and component placement program
gold/nickel plating
a gold plating generally required for contact fingers. Common specifications for this plating are: 0.00002" gold over 0.00015" nickel. Without specification, manufacturer generally plate a min. of 0.00001" of gold over min. of 0.00002" nickel
H.A.L
Hot Air Leveling, uses in conjunction with SMOBC (solder mask over bare copper), plates solder on component pads only (instead of Tin-plated traces and pad surface)
Hardness
the ability to resist penetration
High-mix, low-volume
a contract manufacturing environment where the products being assembled vary in application, lot size and production processes
IC
integrated circuit
impedance control
Impedance control refers to a dual process of designing and manufacturing of high speed circuit boards. As the frequency of a circuit goes up to a certain point (a few hundred Mega Hz), circuit traces will act as transmission lines and require impedance matching
in-circuit test
A test to verify components' behaviors after they have mounted on board. Programming and high charge set up are involved, therefore, only suitable for high volume production. Generally, functional tests are performed as an alternative to this test in most applications
Intellectual property
any product of the human intellect that is unique, novel and unobvious, and has some value in the marketplace. It includes ideas, inventions, business methods and manufacturing processes
IP
Intellectual property. Any product of the human intellect that is unique, novel and unobvious, and has some value in the marketplace. It includes ideas, inventions, business methods and manufacturing processes.
IPC-A-600
an industrial grade quality standard for acceptance of PCBs
IPC-D-356
a CAD/CAM data exchange format developed by IPC. Accepted by some CAM systems for use of photoplotting, electrical testing and other CAM functions
ISO
International Standards Organization
ISO 9001:2000
designation that indicates a facility's conformance to quality standards in operations management, especially as it relates to quality control and customer service.
Joint service agreement
a document used in conjunction with a contract to define the processes, performance targets and expectations of both an OEM and a contract manufacturer.
JSA
Joint service agreement. A document used in conjunction with a contract to define the processes, performance targets and expectations of both an OEM and a contract manufacturer.
Laser etching and marking
the use of a laser to etch designs, lettering, numbers or symbols onto the surface of a material. The use of a YAG laser to produce marks and lettering or numbering on the surface of a party by burning the plating, such as an anodized surface
Laser machining
the cutting of a material with a CO2 or YAG laser to produce intricate part shapes and holes; it is usually a through-cut process
Laser welding
A welding process that obtains fusion by directing a highly concentrated beam of coherent light on a very small spot
LCD
liquid crystal display
lead span
distance between pins of radial or axial components, or spacing between pins of any pre-formed radial or axial components
Low-mix, high-volume
a contract manufacturing environment where there are a few number of assemblies produced in large quantities. High-volume production may last for weeks or months using the same setup.
LPI
Liquid Photo-Imageable solder mask, as compared to traditional screen wet mask, LPI has an advantage due to its precision
LSI
large scale integrated circuit
manufacturability
A term defines the ability of meeting manufacturing requirements
Manufacturing and supply agreement
a contract that defines responsibilities & bridges the relationship between an OEM and a contract manufacturer. It outlines what the EMS provider is required to do for the OEM and at what "cost" to the provider
mask
See solder mask
Medium-mix, medium-volume
a contract manufacturing environment where production volumes remain relatively stable for an extended period of time
Microdeburring
the process of removing burrs from metal machined to subminiature dimensions
MIL-P-55110C
A military grade quality standard for acceptance of PCBs
MIL-STD-275E
A military grade quality standard for design layout of PCBs
Milling
a machining operation in which metal the work piece into contact with a horizontally or vertically mounted cutter
MSA
Manufacturing and supply agreement. Contract that defines responsibilities and bridges the relationship between an OEM and a contract manufacturer. It outlines what the EMS provider is required to do for the OEM and at what "cost" to the provider
multi-layered PCB
PCB layers are referred to as number of sides of copper foil used. PCB with one side of copper foil is called single-sided, with two sides of foil is double-sided and so on. PCBs with more than two sides of copper are defined as multi-layered
net-list
an ASCII list describes logical connections between component pins. Generated from schematic capture systems for transferring logical connections to layout systems
New product introduction
a set of integrated processes used to convert a product design into a manufacturing-ready product while meeting cost, quality and time-to-market objectives
non-plated-through
a type of hole on circuit board generally used as mounting holes. The wall of these holes/slots are not plated thus no connection between layers
NPI
New product introduction. A set of integrated processes used to convert a product design into a manufacturing-ready product while meeting cost, quality and time-to-market objectives
ODM
original design manufacturing - whereby the manufacturer owns the design of the products and the products are marketed under the customer's own brand name
OEM
original equipment manufacturer - whereby products are manufactured in whole or in part in accordance with the customer's specifications
OLB
outer lead bonding - an advanced technology used to connect PCBs and large-scale integrated circuits with a large number of connectors
Optics
any lens, prism or mirror used to direct light (as in an instrument)
Original design manufacturer
a company that manufactures products of its own designs
Original equipment manufacturer
a company that designs and specifies products under its own company name
Outsourcing
the process of subcontracting a process, such as product design or manufacturing, to a third-party company
Oxide
a compound of oxygen with one or more metallic elements
panelization
a general term in CAM editing refers to step/repeat and other CAM editing to prepare data in panel format
Parameters
the variables which determine the dimensions of a machined part as well as the operational sequence of the machine tools used to produce the part
PC-103
a common type of solder mask, has shiny lighter finish than SR-1000
PC-104
a common type of solder mask, has shiny lighter finish than SR-1000
PCB
printed circuit board
PDA
personal digital assistant
Photo plotting or photo plot
photoplotting is an electronic optical process to scan rasterized image data on films. Some times referred to as laser plotting
plated-through
types of holes on circuit board generally used as for component pins and vias. The wall of these holes/slots are plated thus circuit between layers are connected
PNC
Parallel Numeric Control
PPM
parts per million
push-back
a PCB panel format with board units punched out form the panel then reset back into the same location by a second operation
PVC
polyvinyl chloride
radial leaded component
radial leaded components are standing type discrete components, examples are disc capacitors and TO-92 type transistors
registration
the layer alignment of data, artwork, films, imaging process, screening, lamination, drilling and routing
Repeatability
the ability of a machine to perform the same operation any number of times to a specified degree of accuracy
Request for quote
a document that is prepared by the OEM and submitted to the EMS provider for quotation. It typically includes product specifications and quantities, in addition to a BOM
RF
radio frequency
RFQ
Request for quote. A document that is prepared by the OEM and submitted to the EMS provider for quotation. It typically includes product specifications and quantities, in addition to a BOM
sequencing
an assembly term refers to arranging axial / radial components in their order of insertion sequence
SMOBC
Solder mask over bare copper, use in conjunction with H.A.L (hot air leveling), denotes solder mask applied to bare copper
SMT
surface mount technology - a fully automated manufacturing system to mount or solder electrical and/or electronic components on the surface of a PCB
solder mask
a non-conductive resistant printed on surface of a circuit board to protest circuit from oxidation, and circuit shorts during wave-soldering
solder paste
form of solder to be printed on SMD pads by using a stencil in assembly
span
component span refers to the center to center lead spacing of axial and radial components
stencil
stencil is a cooper foil screen with SMD pads etched openings use for solder paste printing in assembly
Step and repeat
a general term in photo tooling that refers to step and repeat image
TAB
tape automated bonding
TCP
tape carrier packaging - a package form of IC or LSI
testability
A term defines the ability of meeting electrical requirements
through hole
A type of holes on circuit board generally used as for component pins and vias
Time to market
the length of time it takes to introduce products into the marketplace. Faster time to market is a critical business objective for manufacturers.
Time to volume
the length of time it takes to bring a product from prototype to a high-volume production mode
Tin-lead reflow
commonly used solder plating process in the PCB industry
tolerance
the range of variation permitted in maintaining a specified
tooling
selection of tools needed to produce desired contours and dimensions of a machined metal part
UL
Underwriters Laboratories, a recognized agent to test and approve electronic processes for meeting the standards set by the organization
Ultrasonic cleaning
in a controlled bath, cleaning solutions are developed to remove surface contaminants found on parts
v-scoring
a board profiling process created by the blade cutting straight lines form both sides of board
via
interconnection between circuit layers. Common type of via connects traces on all layers, blind via or buried via are connected to defined layers only
warping
warping generally refers to finished board warp and twist
Waterjet machining
a fine, high-pressure, high-velocity jet of water directed by a small nozzle used to cut hard or soft materials
wave-soldering
a machine soldering process involves pre-heat, fluxing, soldering, and cleaning
WB
wire bonding
wet mask
general type of solder mask applied by screen